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Published Oct.14 2026,16:25 PM (GMT+8)
Hyperscale CSPs are ramping up investments in servers and AI infrastructure, according to TrendForce’s latest AI server industry research...
Published Oct.13 2026,04:39 AM (GMT+8)
TrendForce’s latest research on AI interconnect technologies reveals that growing demand for high-speed transmission in AI data centers is accelerating the transition of co-packaged optics...
Published Sep.30 2026,16:30 PM (GMT+8)
TrendForce’s latest memory industry research reveals that DRAM suppliers continue to prioritize advanced-process capacity for high-performance...
Published Sep.29 2026,18:02 PM (GMT+8)
TrendForce’s latest research reveals that continued expansion in AI server demand is keeping HBM and conventional DRAM in competition for limited advanced-process and wafer capacity...
Published Sep.24 2026,14:20 PM (GMT+8)
According to TrendForce, the MLCC industry is experiencing a structural shift as AI demand continues to displace traditional markets. Leading Japanese and Korean suppliers are increasingly reducing their supply of consumer-oriented MLCCs...
Published Sep.22 2026,15:38 PM (GMT+8)
According to TrendForce statistics, the global DRAM module market generated $21.2 billion in revenue in 2025, up a strong...
Published Sep.21 2026,15:17 PM (GMT+8)
U.S. CSPs have recently upgraded their enterprise SSD demand forecasts over the past two weeks, according to TrendForce’s research...
Published Sep.18 2026,17:15 PM (GMT+8)
TrendForce’s latest research into advanced semiconductor packaging reveals that GPU suppliers and hyperscale CSPs are continuing to develop increasingly...
Published Sep.16 2026,17:19 PM (GMT+8)
TrendForce’s latest AI server industry research reports that CSPs are accelerating...
Published Sep.14 2026,16:34 PM (GMT+8)
TrendForce’s latest memory industry research indicates that the NOR Flash market is undergoing its most significant structural shift in supply and demand in nearly a decade...
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