% of growth from Die Shrink.
| Micron |
It already uses 0.15um on major 128Mb and plans to move
into 0.13 at year 2002.
|
| Samsung |
Just migrated from 0.17um to 0.15um and currently adopting
advances at the 0.12um level. Samsung claims that 10% of production will
use an average 0.12um in Q4, 2001. |
| Hynix |
It is moving from 0.18um to 0.16um and to 0.15um for 6
fabs. |
| NEC |
Migrates from 0.18um to 0.15um. Will be adopting 0.13 processes
in 2002. |
| Toshiba |
Plans to migrate from 0.175um to 0.13 at the end of this
year. |
| Hitachi |
moves from 0.18um to 0.15um. |
| Infineon |
It uses 0.17um right now and is going to test 0.14um. |
| Windond |
Currently uses 0.17/0.175um, and plans to move into 0.13
by cooperating with Toshiba |
| Promos |
Will move from 0.17um to 0.14um at the end of this year. |
| Powerchip |
Just announced success in its migration from 0.18um to
0.16um. And plans to move into 0.15um and then to 0.13um. |
| Nanya |
Plans to migrate from 0.17um to 0.14um at 4Q of this year
and 0.11um by year 2003. |
| Vangard |
Plans to move from 0.17um to 0.15um. |
