Our previous market info on August 14th- Subject " Die Shrink for seeking lower cost"
We listed the process migrations status as following.
| Micron |
It already uses 0.15um on major 128Mb and plans to move into 0.13 at year 2002. |
| Samsung | Just migrated from 0.17um to 0.15um and currently adopting advances at the 0.12um level. Samsung claims that 10% of production will use an average 0.12um in Q4, 2001. |
| Hynix | It is moving from 0.18um to 0.16um and to 0.15um for 6 fabs. |
| NEC | Migrates from 0.18um to 0.15um. Will be adopting 0.13 processes in 2002. |
| Toshiba | Plans to migrate from 0.175um to 0.13 at the end of this year. |
| Hitachi | moves from 0.18um to 0.15um. |
| Infineon | It uses 0.17um right now and is going to test 0.14um. |
| Windond | Currently uses 0.17/0.175um, and plans to move into 0.13 by cooperating with Toshiba |
| Promos | Will move from 0.17um to 0.14um at the end of this year. |
| Powerchip | Just announced success in its migration from 0.18um to 0.16um. And plans to move into 0.15um and then to 0.13um. |
| Nanya | Plans to migrate from 0.17um to 0.14um at 4Q of this year and 0.11um by year 2003. |
| Vangard | Plans to move from 0.17um to 0.15um. |
Currently we surveyed the growth % from those gross die from migration. For your reference only.
| Company | DRAM Process Migration | based on | % of growth/wf |
| Micron | 0.18um to 0.15um begin in 4Q/00 | 128M | 53% |
| Samsung | 0.175um to 0.15um begin in 3Q/01 | 128M | 32% |
| Winbond | 0.175um new version begin in3Q/01 | 256M | 17% |
| Nanya | 0.175um new version begin in 2Q/01 | 128M | 20% |
| Promose | 0.175um to 0.14um begin in 4Q/01 | 256M | 48% |
| Power Chip | 0.18um to 0.165um begin 9n 3Q/01 | 128M | 23% |
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