Stack Technology Group.

Figure 1. Stack technology group.

NEC and Hitachi separated their DRAM business division to start up "Elpida" in 1999.

Mitsubishi separated its DRAM sales division into Elpida from 2003. Meanwhile, Mitsubishi will also terminate the technology agreement with Powerchip at 0.12um. - Powerchip capacity reservation for Mitsubishi will also terminate in 2003.

Elpida has a 0.11 um technology agreement with Powerchip. The agreement also will involve Powerchip capacity reservation for Elpida.

Trench Technology Group.

Figure 2. Trench technology group.

IBM, Infineon and Toshiba used to be a group to co-developing trench technology. Toshiba retreated from DRAM business in 2001 and terminated the technology translation agreement with Winbond. The capacity reservation agreement also ended in April 2002.

IBM also dropped out from developing DRAM technology. The technology transfers from IBM to Nanya tech will stop at 0.14/0.11um.

Infineon and Nanya announced cooperation on developing 0.09um and 0.07um technology in 2002. A 50/50 join venture company - Hwaya will be set up to run 12" memory fab for both Infineon and Nanya.

Infineon has to renew the capacity reservation agreement with Mosel/ProMOS from 2003. The technology license agreement between Infineon and ProMOS will stop at 0.11um.